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2018
  1.  Hadi Parsamehr, Shou-Yi Chang, and Chih-Huang Lai*, “Mechanical and Surface Properties of Aluminum-Copper-Iron Quasicrystal Thin Films”, Journal of Alloys and Compounds, 2018, JAN, vol. 732 (25), pp. 952-957.
  2.  Chen-Hong Liao, Pei-Sung Hung, Yu Cheng, Shou-Yi Chang, and Pu-Wei Wu*, “Mechanical Properties of Three-dimensional Ordered Macroporous Ni Foam”, Materials Letters, 2018, MAR, vol. 215, pp. 152-156.
  3. Shou-Yi Chang*, Bo-Jien Chen, Yu-Ting Hsiao, Ding-Shiang Wang, Tai-Sheng Chen, Ming-Sheng Leu, and Hong-Jen Lai, “Preparation and Nanoscopic Plastic Deformation of Toughened Al-Cu-Fe-based Quasicrystal/Vanadium Multilayered Coatings”, Materials Chemistry and Physics, 2018, JUL, vol. 213, pp. 277-284.
  4. Ting-Chun Lin,Chao-Chun Yen†,Shao-Yi Lin†, Yi-Chung Huang‡, Chi-Huan Tung‡, Yu-Ting Hsiao, andShou-Yi Chang*, “Small-Size-Induced Plasticity and Dislocation Activities on Non-Charge-Balanced Slip System of Ionic MgO Pillars”, Nano Letters, 2018, AUG, vol. 18, pp. 4993-5000.
  5. Y. Ruan, F.P. Dai, Shou-Yi Chang, and B. Wei*, “Thermodynamic Characteristics, Phase Separation, and Nanomechanical Properties of Ternary Fe-Co-Cu Alloys with Equiatomic Fe and Co Compositions”, Metallurgical and Materials Transactions A, 2018, DEC, vol. 49 (12), pp. 6255-6264.
2017
  1. Ding-Shiang Wang, Shou-Yi Chang*, Tai-Sheng Chen, Tung-Huan Chou, Yi-Ching Huang, Jin-Bao Wu, Ming-Sheng Leu, and Hong-Jen Lai*, “Stress Writing Textured Graphite Conducting Wires/Patterns in Insulating Amorphous Carbon Matrix as Interconnects”, Scientific Reports, 2017, AUG, vol. 7, pp. 9727 (pp. 1-10).
  2. Yi-Ching Huang, Shou-Yi Chang*, and Jih-Mirn Jehng, “Photocatalytic H2 Generation Efficiencies of TiO2 Nanotube-based Heterostructures Grafted with ZnO Nanorods, Ag Nanoparticles, or Pd Nanodendrites”, Journal of Physical Chemistry C, 2017, SEP, vol. 121 (35), pp. 19063-19068.
  3. Y. Ruan*, Q. Q. Wang, Shou-Yi Chang, and B. Wei*, “Structural Evolution and Micromechanical Properties of Ternary Al-Ag-Ge Alloy Solidified under Microgravity Condition”, Acta Materialia, 2017, DEC, vol. 141, pp. 456-465.
2015
  1.  Hsiao-Ling Chen†, Yu-Tang Tung†, Chia-Hui Chuang†, Min-Yu Tu†, Tung-Chou Tsai, Shou-Yi Chang, and Chuan-Mu Chen*, “Kefir Improves Bone Mass and Microarchitecture in an Ovariectomized Rat Model of Postmenopausal Osteoporosis”, Osteoporosis International, 2015, FEB, vol. 26 (2), pp. 589-599.
  2. Shou-Yi Chang*, Li-Ping Liang, Lin-Chieh Kao, and Chia-Feng Lin, “Electroless- and Electroplating of Cu(Re) Alloy Films for Self-forming Ultrathin Re Diffusion Barrier”, Journal of The Electrochemical Society, 2015, MAR, vol. 162 (3), pp. D96-D101.
  3. Nai-Hao Yang†, Shou-Yi Chang*,†, Chien-Yen Liu, Kai-Chieh Wu, Su-Jien Lin*, and Jien-Wei Yeh, “Phase and Structure Development of Spontaneously Ambient-grown ZnO·xH2O and TiO2·xH2O towards Oxide Single Crystals”, RSC Advances, 2015, MAY, vol. 5 (44), pp. 35061-35069.
  4. Y. Ruan*, X.J. Wang, and Shou-Yi Chang, “Two Hardening Mechanisms in Al-Cu-Ge Alloys Undercooled to High Level”, Acta Materialia, 2015, JUN, vol. 91, pp.183-191.
  5. Che-Wei Tsai, Ming-Hung Tsai, Kun-Yo Tsai, Shou-Yi Chang, Jien-Wei Yeh*, and An-Chou Yeh, “Microstructure and Tensile Properties of Al0.5CoCrCuFeNi Alloys Produced by Simple Rolling and Annealing”, Materials Science and Technology, 2015, JUL, vol. 31 (10), pp. 1178-1183.
  6. Kai-Chieh Wu, Jien-Wei Yeh*, and Shou-Yi Chang, “Refined Microstructure and Improved Mechanical Properties of High-ratio Extruded AZ91-xSn Magnesium Alloy”, Materials Chemistry and Physics, 2015, JUL, vol. 162, pp. 757-763.
  7. Du-Cheng Tsai, Min-Jen Deng, Zue-Chin Chang, Bing-Hau Kuo, Erh-Chiang Chen, Shou-Yi Chang, and Fuh-Sheng Shieu*, “Oxidation Resistance and Characterization of (AlCrMoTaTi)-Six-N Coating Deposited via Magnetron Sputtering”, Journal of Alloys and Compounds, 2015, OCT, vol. 647, pp. 179-188.
  8. Kai-Chieh Wu, Shou-Yi Chang, and Jien-Wei Yeh*, “Optimizing Superplasticity of AZ91-xSn Magnesium Alloys with Competitive Grain Growth and Boundary Sliding”, Materials Science and Engineering A, 2015, OCT, vol. 646, pp. 201-206.
  9. Ying Ruan*, Shou-Yi Chang, and Ming Dao*, “Comparative Effect of Rapid Dendrite Growth and Element Addition on Microhardness Enhancement of Fe-Based Alloys”, Crystal Growth & Design, 2015, NOV, vol. 15, pp. 5661-5664.

2014

  1. Shao-Yi Lin, Shou-Yi Chang*, Chia-Jung Chang, and Yi-Chung Huang, “Nanomechanical Properties and Deformation Behaviors of Multi-component (AlCrTaTiZr)NxSiy High-entropy Coatings”, Entropy, 2014, JAN, vol. 16 (1), pp. 405-417.
  2. Shou-Yi Chang*, Chen-En Li, Yi-Chung Huang, Hsun-Feng Hsu, Jien-Wei Yeh, and Su-Jien Lin, “Structural and Thermodynamic Factors of Suppressed Interdiffusion Kinetics in Multi-component High-entropy Materials”, Scientific Reports, 2014, FEB, vol. 4, pp. 4162 (pp. 1-8).
  3. Du-Cheng Tsai, Zue-Chin Chang, Bing-Hau Kuo, Ming-Hua Shiao, Shou-Yi Chang, and Fuh-Sheng Shieu*, “Structure and Properties of (TiVCrZrY)N Coatings Prepared by Energetic Bombardment Sputtering with Different Nitrogen Flow Ratios”, Applied Physics A: Materials Science & Processing, 2014, JUN, vol. 115 (4), pp. 1205-1213.
  4. Yi-Ching Huang†, Shou-Yi Chang*,†, Lisa Huang, and Chia-Feng Lin, “Growing Metal Trees on Tubular Semiconductor Land: TiO2/(Zn,Sn)Pd Heterostructures with High SERS and Photocatalytic Activity”, Journal of Materials Chemistry A, 2014, JUN, vol. 2 (22), pp. 8456-8464.
  5. Ding-Shiang Wang†, Shou-Yi Chang*,†, Yi-Chung Huang, Jin-Bao Wu, Hong-Jen Lai*, and Ming-Sheng Leu, “Nanoscopic Observations of Stress-induced Formation of Graphitic Nanocrystallites at Amorphous Carbon Surfaces”, Carbon, 2014, AUG, vol. 74, pp. 302-311.
  6. Du-Cheng Tsai, Zue-Chin Chang, Bing-Hau Kuo, Shou-Yi Chang, and Fuh-Sheng Shieu*, “Effects of Silicon Content on The Structure and Properties of (AlCrMoTaTi)N Coatings by Reactive Magnetron Sputtering”, Journal of Alloys and Compounds, 2014, DEC, vol. 616, pp. 646-651.

2013

  1. Ming-Hao Chuang, Ming-Hung Tsai, Che-Wei Tsai, Nai-Hao Yang, Shou-Yi Chang, Jien-Wei Yeh, Swe-Kai Chen, and Su-Jien Lin*, “Intrinsic Surface Hardening and Precipitation Kinetics of Al0.3CrFe1.5MnNi0.5 Multi-component Alloy”, Journal of Alloys and Compounds, 2013, FEB, vol. 551, pp. 12-18.
  2. P. Yiu, Y.C. Chen, J.P. Chu, S.Y. Chang, H. Bei, J.S.C. Jang, and C.H. Hsueh*, “Rapid Relaxation and Embrittlement of Zr-based Bulk Metallic Glasses by Electropulsing”, Intermetallics, 2013, MAR, vol. 34, pp. 43-48.
  3. Nai-Hao Yang, Chien-Chia Tseng, Jyun-Lin Wu, Chien-Chang Juan, Su-Jien Lin*, and Shou-Yi Chang, “One-Step Molten-Salt Synthesis of BaTi4O9 Nanowires with Oxygen Deficiency-Enhanced Dielectric Performance”, RSC Advances, 2013, MAY, vol. 3 (19), pp. 7093-7099.
  4. J.H. Hsieh*, T.H. Yeh, S.Y. Chang, C. Li, C.C. Tseng, and W. Wu, “Mechanical and Antibacterial Behaviors of TaN-Cu Nanocomposite Thin Films after Multi-rejuvenation”, Surface & Coatings Technology, 2013, AUG, vol. 228 (S1), pp. S81-S85.
  5. J.H. Hsieh*, T.H. Yeh, C. Li, S.Y. Chang, C.H. Chiu, and C.T. Huang, “Mechanical Properties and Antibacterial Behaviors of TaN-(Ag,Cu) Nanocomposite Thin Films after Annealing”, Surface & Coatings Technology, 2013, AUG, vol. 228 (S1), pp. S116-S119.
  6. Du-Cheng Tsai, Zue-Chin Chang, Bing-Hau Kuo, Ming-Hua Shiao, Shou-Yi Chang, and Fuh-Sheng Shieu*, “Structural Morphology and Characterization of (AlCrMoTaTi)N Coating Deposited via Magnetron Sputtering”, Applied Surface Science, 2013, OCT, vol. 282 (1), pp. 789-797.
  7. J.H. Hsieh*, C.H. Chiu, C. Li, W. Wu, and S.Y. Chang, “Development of Anti-wear and Anti-bacteria TaN-(Ag,Cu) Thin Films ― A Review”, Surface & Coatings Technology, 2013, OCT, vol. 233, pp. 159-168.
  8. Ying-Ting Wang†, Shou-Yi Chang*,†, Yi-Chung Huang, Tung-Chou Tsai, Chuan-Mu Chen, and Chwee Teck Lim*, “Nanomechanics Insights into the Performance of Healthy and Osteoporotic Bones”, Nano Letters, 2013, NOV, vol. 13 (11), pp. 5247-5254.
  9. Shou-Yi Chang*, Yi-Ching Huang, Chen-En Li, Hsun-Feng Hsu, Jien-Wei Yeh, and Su-Jien Lin, “Improved Diffusion-Resistant Ability of Multi-component Nitrides: from Unitary TiN to Senary High-Entropy (TiTaCrZrAlRu)N”, JOM, 2013, DEC, vol. 65 (12), pp. 1790-1796.
2012
  1. Shou-Yi Chang*, Jen-Yi Chen, Shau-Yu Wen, and Tz-Yun Jian, “Growth Mechanism and Structural Correlations of Hydroxyapatites on Surface Functionalized Carbon Fibers”, Journal of The Electrochemical Society, 2012, JAN, vol. 159 (1), pp. D31-D35.
  2. Shou-Yi Chang*, Chen-En Li, Sheng-Cheng Chiang, and Yi-Chung Huang, “4-nm Thick Multilayer Structure of Multi-component (AlCrRuTaTiZr)Nx as Robust Diffusion Barrier for Cu Interconnects”, Journal of Alloys and Compounds, Letters, 2012, FEB, vol. 515, pp. 4-7.
  3. Chia-Cheng Chang, Jyun-Lin Wu, Nai-Hao Yang, Su-Jien Lin*, and Shou-Yi Chang*, “Synthesis and Growth Twining of γ-Al2O3 Nanowires by Simple Evaporation of Al-Si Alloy Powder”, CrystEngComm, 2012, FEB, vol. 14 (3), pp. 1117-1121.
  4. P. Yiu, J.S.C. Jang, S.Y. Chang, Y.C. Chen, J.P. Chu, and C.H. Hsueh*, “Plasticity Enhancement of Zr-based Bulk Metallic Glasses by Direct Current Electropulsing”, Journal of Alloys and Compounds, 2012, JUN, vol. 525, pp. 68-72.
  5. Ding-Shiang Wang, Shou-Yi Chang*, Yi-Chung Huang, Jin-Bao Wu, Hong-Jen Lai, and Ming-Sheng Leu, “Reduced Roughness and Enhanced Mechanical Properties of Multilayered Diamond-Like Carbon Films by Periodic Arc Deposition”, Journal of The Electrochemical Society, 2012, JUN, vol. 159 (6), pp. P51-P56.
  6. Shao-Yi Lin, Shou-Yi Chang*, Yi-Chung Huang, Fuh-Sheng Shieu, and Jien-Wei Yeh, “Mechanical Performance and Nanoindenting Deformation of (AlCrTaTiZr)NCy Multi-component Coatings Co-sputtered with Bias”, Surface & Coatings Technology, 2012, AUG, vol. 206 (24), pp. 5096-5102.
  7. J.H. Hsieh*, T.H. Yeh, S.Y. Hung, S.Y. Chang, W. Wu, and C. Li, “Antibacterial and Tribological Properties of TaN-Cu, TaN-Ag, and TaN-(Ag,Cu) Nanocomposite Thin Films”, Materials Research Bulletin, 2012, OCT, vol. 47 (10), pp. 2999-3003.

2011

  1. Shou-Yi Chang* and Dao-Sheng Chen, “(AlCrTaTiZr)N/(AlCrTaTiZr)N0.7 Bilayer Structure of High Resistance to the Interdiffusion of Cu and Si at 900°C”, Materials Chemistry and Physics, Communication, 2011, JAN, vol. 125 (1-2), pp. 5-8.
  2. Shou-Yi Chang*, Chen-Yuan Wang, Ming-Ku Chen, and Chen-En Li, “Ru Incorporation on Marked Enhancement of Diffusion Resistance of Multi-component Alloy Barrier Layers”, Journal of Alloys and Compounds, Letters, 2011, FEB, vol. 509 (5), pp. L85-L89.
  3. Du-Cheng Tsai, Yen-Lin Huang, Sheng-Ru Lin, De-Ru Jung, Shou-Yi Chang, and Fuh-Sheng Shieu*, “Structure and Mechanical Properties of (TiVCr)N Coatings Prepared by Energetic Bombardment Sputtering with Different Nitrogen Flow Ratios”, Journal of Alloys and Compounds, 2011, FEB, vol. 509 (6), pp. 3141-3147.
  4. Shou-Yi Chang*, Sih-Fan Chen, and Yi-Ching Huang, “Synthesis, Structural Correlations and Photocatalytic Properties of TiO2 Nanotube/SnO2-Pd Nanoparticle Heterostructures”, Journal of Physical Chemistry C, 2011, FEB, vol. 115 (5), pp. 1600-1607.
  5. Shou-Yi Chang*,†, Nai-Hao Yang†, Yi-Chung Huang, Su-Jien Lin, Theo Z. Kattamis, and Chien-Yen Liu, “Spontaneous Growth of One-Dimensional Nanostructures from Films in Ambient Atmosphere at Room Temperature: ZnO and TiO2”, Journal of Materials Chemistry, 2011, MAR, vol. 21 (12), pp. 4264-4271.
  6. Du-Cheng Tsai, Yen-Lin Huang, Sheng-Ru Lin, De-Ru Jung, Shou-Yi Chang, and Fuh-Sheng Shieu*, “Diffusion Barrier Performance of TiVCr Alloy Film in Cu Metallization”, Applied Surface Science, 2011, MAR, vol. 257 (11), pp. 4923-4927.
  7. Shou-Yi Chang*, Chen-Yuan Wang, Chen-En Li, and Yi-Chung Huang, “5 nm-Thick (AlCrTaTiZrRu)N0.5 Multi-component Barrier Layer with High Diffusion Resistance for Cu Interconnects”, Nanoscience and Nanotechnology Letters, 2011, APR, vol. 3 (2), pp. 289-293.
  8. Keng-Liang Ou, Ren-Jei Chung*, Fu-Yi Tsai, Pei-Yu Liang, Shih-Wei Huang, and Shou-Yi Chang, “Effect of Collagen on the Mechanical Properties of Hydroxyapatite Coatings”, Journal of the Mechanical Behavior of Biomedical Materials, 2011, MAY, vol. 4 (4), pp. 618-624.
  9. Shou-Yi Chang*, Shao-Yi Lin, and Yi-Chung Huang, “Microstructures and Mechanical Properties of Multi-component (AlCrTaTiZr)NxCy Nanocomposite Coatings”, Thin Solid Films, 2011, MAY, vol. 519 (15), pp. 4865-4869.
  10. Ming-Shiou Lin, Chia-Feng Lin*, Wan-Chun Huang, Guei-Miao Wang, Bing-Cheng Shieh, Jing-Jie Dai, Shou-Yi Chang, D. S. Wuu, Po-Liang Liu, and Ray-Hua Horng, “Chemical-Mechanical Lift-Off Process for InGaN Epitaxial Layers”, Applied Physics Express, 2011, JUN, vol. 4 (6), 062101.
  11. Yi-Ching Huang, Shou-Yi Chang*, Chia-Feng Lin, and Wenjea J. Tseng, “Synthesis of ZnO Nanorod Grafted TiO2 Nanotube 3-D Arrayed Heterostructure as Supporting Platform for Nanoparticle Deposition”, Journal of Materials Chemistry, 2011, AUG, vol. 21 (36), pp. 14056-14061.
  12. Du-Cheng Tsai, Yen-Lin Huang, Sheng-Ru Lin, De-Ru Jung, Shou-Yi Chang, Zue-Chin Chang, Min-Jen Deng, and Fuh-Sheng Shieu*, “Characteristics of a 10 nm-thick (TiVCr)N Multi-component Diffusion Barrier Layer with High Diffusion Resistance for Cu Interconnects”, Surface & Coatings Technology, 2011, AUG, vol. 205 (21-22), pp. 5064-5067.
  13. Yuan-Ting Chang†, Chuan-Mu Chen†, Ming-Yu Tu†, Hsiao-Ling Chen, Shou-Yi Chang*, Tung-Chou Tsai, Ying-Ting Wang, and Hsiang-Long Hsiao, “Effects of Osteoporosis and Nutrition Supplements on Structures and Nanomechanical Properties of Bone Tissue”, Journal of the Mechanical Behavior of Biomedical Materials, 2011, OCT, vol. 4 (7), pp. 1412-1420.

    2010

    1. Shou-Yi Chang*, Yi-Chung Huang, and Yu-Mu Lin, “Mechanical Property and Fracture Behavior Characterizations of 96.5 Sn-3.0 Ag-0.5 Cu Solder Joints”, Journal of Alloys and Compounds, 2010, FEB, vol. 490 (1-2), pp. 508-514.
    2. Du-Cheng Tsai, Fuh-Sheng Shieu*, Shou-Yi Chang, Hsiao-Chiang Yao, and Min-Jen Deng, “Structures and Characterizations of TiVCr and TiVCrZrY Films Deposited by Magnetron Sputtering under Different Bias Powers”, Journal of The Electrochemical Society, 2010, MAR, vol. 157 (3), pp. K52-K58.
    3. Shou-Yi Chang* and Dao-Sheng Chen, “Ultra-thin (AlCrTaTiZr)Nx/AlCrTaTiZr Bilayer Structures with High Diffusion Resistance for Cu Interconnects”, Journal of The Electrochemical Society, 2010, JUN, vol. 157 (6), pp. G154-G159. (SCI, IF2017 = 3.259, 2/19 = 10.5%, Category: Materials Science, Coating & Films; Cited: 4) Selected for Virtual Journal of Nanoscale Science & Technology, 2010, MAY 17, vol. 21 (20).
    4. Yi-Chung Huang and Shou-Yi Chang*, “Substrate Effect on Mechanical Characterizations of Aluminum-Doped Zinc Oxide Transparent Conducting Films”, Surface & Coatings Technology, 2010, JUN, vol. 204 (20), pp. 3147-3153.
    5. Shou-Yi Chang*, Shao-Yi Lin, Yi-Chung Huang, and Chia-Liang Wu, “Mechanical Properties, Deformation Behaviors and Interface Adhesion of (AlCrTaTiZr)Nx Multi-component Coatings”, Surface & Coatings Technology, 2010, JUL, vol. 204 (20), pp. 3307-3314.
    6. Ming-Shiou Lin, Chi-Chi Chen, Wei-Cheng Wang, Chia-Feng Lin, and Shou-Yi Chang, “Fabrication of The Selective-Growth ZnO Nanorods with a Hole-Array Pattern on a p-Type GaN:Mg Layer through a Chemical Bath Deposition Process”, Thin Solid Films, 2010, OCT, vol. 518 (24), pp. 7398-7402.

    2009

    1. Shou-Yi Chang*, Ming-Ku Chen, and Dao-Sheng Chen, “Multiprincipal-Element AlCrTaTiZr-Nitride Nanocomposite Film of Extremely High Thermal Stability as Diffusion Barrier for Cu Metallization”, Journal of The Electrochemical Society, 2009, MAY, vol. 156 (5), pp. G37-G42.
    2. Yi-Chung Huang, Shou-Yi Chang*, and Chih-Hsiang Chang, “Effect of Residual Stresses on Mechanical Properties and Interface Adhesion Strength of SiN Thin Films”, Thin Solid Films, 2009, JUL, vol. 517 (17), pp. 4857-4861.
    3. Shou-Yi Chang* and Ming-Ku Chen, “High Thermal Stability of AlCrTaTiZr Nitride Film as Diffusion Barrier for Copper Metallization”, Thin Solid Films, 2009, JUL, vol. 517 (17), pp. 4961-4965.
    4. Shou-Yi Chang* and Dao-Sheng Chen, “10 nm-Thick Quinary (AlCrTaTiZr)N Film as Effective Diffusion Barrier for Cu Interconnects at 900°C”, Applied Physics Letters, 2009, JUN, vol. 94 (23), 231909 (pp. 1-3). (SCI, IF2017 = 3.411, 29/148 = 19.6%, Category: Physics, Applied; Cited: 26) Selected for Virtual Journal of Nanoscale Science & Technology, 2009, JUN 22, vol. 19 (25).
    5. Shou-Yi Chang*, Ren-Jei Chung, Fang-Cheng Chou, Hsiang-Long Hsiao, and Hung-Bin Hsu, “Effect of Streptococcus Mutans on Mechanical Properties of Human Dental Structures”, Journal of Materials Research, 2009, JUL, vol. 24 (7), pp. 2301-2306.
    6. Shou-Yi Chang*, Fong-Jie Lin, Chia-Feng Lin, and Hsun-Feng Hsu, “Effect of NH3/He Plasma Treatment on Electrical Reliability and Early-Stage Electromigration Behavior of Copper Interconnects”, Journal of The Electrochemical Society, 2009, SEP, vol. 156 (9), pp. D343-D347.
    7. Shou-Yi Chang*, Nai-Hao Yang, and Yi-Chung Huang, “Hydrothermal Growth and Interface Correlation of Highly Aligned ZnO Nanorod Arrays on UV-Activated Sol-Gel Transparent Conducting Films”, Journal of The Electrochemical Society, 2009, NOV, vol. 156 (11), pp. K200-K204.
    8. Yu-Liang Chen, Ya-Huei Hu, Che-Wei Tsai, Jien-Wei Yeh*, Swe-Kai Chen, and Shou-Yi Chang, “Structural Evolution during Mechanical Milling and Subsequent Annealing of Cu-Ni-Al-Co-Cr-Fe-Ti Alloys”, Materials Chemistry and Physics, 2009, DEC, vol. 118 (2-3), pp. 354-361.

    2008

    1. Shou-Yi Chang* and Yi-Chung Huang, “Effect of Plasma Treatments on Interface Chemistry and Adhesion Strength between Porous SiO2 Low-k Film and SiC/SiN Layers”, Microelectronic Engineering, 2008, FEB, vol. 85 (2), pp. 332-338.
    2. Shou-Yi Chang*, Jien-Yi Chang, Su-Jien Lin, Hung-Chun Tsai, and Yee-Shyi Chang, “Interface Chemistry and Adhesion Strength between Porous SiOCH Low-k Film and SiCN Layers”, Journal of The Electrochemical Society, 2008, FEB, vol. 155 (2), pp. G39-G43.
    3. Shou-Yi Chang* and Chia-Ling Lu, “Thermal Stability and Interface Diffusion Behaviors of Electrolessly Deposited CoWP and Cu Films”, Journal of The Electrochemical Society, 2008, MAR, vol. 155 (3), pp. D234-D243. (SCI, IF2017 = 3.259, 2/19 = 10.5%, Category: Materials Science, Coatings & Films; Cited: 6) Selected for Virtual Journal of Nanoscale Science & Technology, 2008, FEB 4, vol. 17 (5).
    4. Shou-Yi Chang, Hung-Chun Tsai, Jien-Yi Chang, Su-Jien Lin*, and Yee-Shyi Chang, “Analyses of Interface Adhesion between Porous SiOCH Low-k Film and SiCN Layers by Nanoindentation and Nanoscratch Tests”, Thin Solid Films, 2008, JUN, vol. 516 (16), pp. 5334-5338.
    5. C.C. Tseng, J.H. Hsieh*, W. Wu, S.Y. Chang, and C.L. Chang, “Surface and Mechanical Characterization of TaN-Ag Nanocomposite Thin Films”, Thin Solid Films, 2008, JUN, vol. 516 (16), pp. 5424-5429.
    6. Hung-Chun Tsai, Yee-Shyi Chang, and Shou-Yi Chang*, “Effect of Plasma Treatments on Interface Adhesion between SiOCH Ultra-Low-k Film and SiCN Etch Stop Layer”, Microelectronic Engineering, 2008, JUL, vol. 85 (7), pp. 1658-1663.
    7. Shou-Yi Chang*, Yian-Chi Hsiao, and Yi-Chung Huang, “Preparation and Mechanical Properties of Aluminum-Doped Zinc Oxide Transparent Conducting Films”, Surface & Coatings Technology, 2008, AUG, vol. 202 (22-23), pp. 5416-5420.
    8. J.H. Hsieh*, P.C. Liu, C. Li, M.K. Cheng, and S.Y. Chang, “Mechanical Properties of TaN-Cu Nanocomposite Thin Films”, Surface & Coatings Technology, 2008, AUG, vol. 202 (22-23), pp. 5530-5534.
    9. J.H. Hsieh*, C.C. Tseng, Y.K. Chang, S.Y. Chang, and W. Wu, “Antibacterial Behavior of TaN-Ag Nanocomposite Thin Films with and without Annealing”, Surface & Coatings Technology, 2008, AUG, vol. 202 (22-23), pp. 5586-5589.
    10. Shou-Yi Chang*, Yi-Chung Huang, Hsin-Hsu Chu, Yian-Chi Hsiao, Nai-Hao Yang, and Chia-Feng Lin, “Low-Temperature Curing of Aluminum-Doped Zinc Oxide Films Assisted by Ultraviolet Exposure”, Scripta Materialia, 2008, SEP, vol. 59 (6), pp. 646-648.
    11. 張守一 (Shou-Yi Chang)*, 周芳正 (Fang-Cheng Chou), and 陳婷婷 (Ting-Ting Chen), “漂白劑及軟性飲料對牙齒組織奈米機械性質及破壞行為之影響 (Effects of Bleaching Agent and Soft Drinks on Nanomechanical Properties and Fracture Behaviors of Dental Structures)”, 興大工程學刊 (Journal of Engineering, National Chung Hsing University, Taiwan), 2008, NOV, vol. 19 (3), pp. 147-158.

    2007

    1. Shou-Yi Chang* and Yi-Chung Huang, “Analyses of Interface Adhesion between Porous SiO2 Low-k Film and SiC/SiN Layers by Nanoindentation and Nanoscratch Tests”, Microelectronic Engineering, 2007, FEB, vol. 84 (2), pp. 319-327.
    2. Shou-Yi Chang* and Ting-Kui Chang, “Grain Size Effect on Nanomechanical Properties and Deformation Behavior of Copper under Nanoindentation Test”, Journal of Applied Physics, 2007, FEB, vol. 101 (3), 033507 (pp. 1-8).
    3. Chia-Feng Lin*, Zhong-Jie Yang, Jing-Jie Dai, Jing-Hui Zheng, and Shou-Yi Chang, “The Self-Assemble GaN:Mg Inverted Hexagonal Pyramids Formatted by Photoelectrochemical Wet-Etching Process”, Thin Solid Films, 2007, MAR, vol. 515 (10), pp. 4492-4495.
    4. 張守一 (Shou-Yi Chang)*, 蕭彥志 (Yian-Chi Hsiao), and 黃奕中 (Yi-Chung Huang), “氧化鋅鋁透明導電膜之製備及其機械性質之研究 (Preparation and Mechanical Properties of Aluminum Zinc Oxide Transparent Conducting Films)”, 興大工程學刊 (Journal of Engineering, National Chung Hsing University, Taiwan), 2007, MAR, vol. 18 (1), pp. 1-13.
    5. 張守一 (Shou-Yi Chang)*, “奈米壓痕測試技術及其特殊應用 (Instrumented Nanoindentation Technology and Its Special Applications)”, 工業材料 (Industrial Materials, Taiwan), 2007, APR, vol. 244, pp. 163-172. (Invited Paper)
    6. Shou-Yi Chang* and Yu-Shuien Lee, “Analyses of Interface Adhesion between Cu and SiCN Etch Stop Layers by Nanoindentation and Nanoscratch Tests”, Japanese Journal of Applied Physics, Part 1, 2007, APR, vol. 46 (4B), pp. 1955-1960.
    7. Shou-Yi Chang*, Yu-Shuien Lee, and Chia-Ling Lu, “Effect of Plasma Treatments on the Interface Chemistry and Adhesion Strength between Cu Metallization and SiCN Etch Stop Layer”, Journal of The Electrochemical Society, 2007, APR, vol. 154 (4), pp. D241-D248. (SCI, IF2017 = 3.259, 2/19 = 10.5%, Category: Materials Science, Coatings & Films; Cited: 6) Selected for Virtual Journal of Nanoscale Science & Technology, 2007, FEB 19, vol. 15 (8).
    8. Jien-Wei Yeh, Shou-Yi Chang*, Yu-Der Hong, Swe-Kai Chen, and Su-Jien Lin, “Anomalous Decrease in X-Ray Diffraction Intensities of Cu-Ni-Al-Co-Cr-Fe-Si Alloy Systems with Multi-principal Elements”, Materials Chemistry and Physics, 2007, MAY, vol. 103 (1), pp. 41-46.
    9. C.C. Tseng, J.H. Hsieh*, W. Wu, S.Y. Chang, and C.L. Chang, “Emergence of Ag Particles and Their Effects on the Mechanical Properties of TaN-Ag Nanocomposite Thin Films”, Surface & Coatings Technology, 2007, OCT, vol. 201 (24), pp. 9565-9570.

    2006

    1. 張守一 (Shou-Yi Chang)* and 林樹均 (Su-Jien Lin), “積體電路用電化學鍍銅製程及薄膜界面強度分析 (Electrochemical Copper Metallization and Interface Adhesion Measurement for ULSI Application)”, 界面科學會誌 (Journal of the Chinese Colloid and Interface Society, Taiwan), 2006, MAR, vol. 28 (1), pp. 11-20. (Invited Paper)
    2. Shou-Yi Chang*, Ting-Kui Chang, and Yu-Shuien Lee, “Deformation Behavior of Electrolessly Deposited Ultrafine Nanocrystalline Copper Films under Instrumented Nanoindentation”, Electrochemical and Solid State Letters, 2006, APR, vol. 9 (4), pp. C73-C76. (SCI, IF2014 = 2.321, 65/258 = 25.2%, Category: Materials Science, Multidisciplinary; Cited: 2) Selected for Virtual Journal of Nanoscale Science & Technology, 2006, FEB 27, vol. 13 (8).
    3. Ying-Chao Sung, Chia-Han Lai, Su-Jien Lin, and Shou-Yi Chang*, “Early-Stage Nucleation Crystallography of Sensitization-Activated Palladium Catalysts and Electrolessly Deposited Copper Films”, Electrochemical and Solid State Letters, 2006, MAY, vol. 9 (5), pp. C85-C87.
    4. Shou-Yi Chang*, Yu-Shuien Lee, and Ting-Kui Chang, “Nanomechanical Response and Creep Behavior of Electrolessly Deposited Copper Films under Nanoindentation Test”, Materials Science and Engineering A, 2006, MAY, vol. 423 (1-2), pp. 52-56.
    5. Chia-Han Lai, Wei-Shun Lai, Hua-Chun Chiue, Hung-Jen Chen, Shou-Yi Chang, and Su-Jien Lin*, “Effect of Nitrogen Addition on the Properties and Thermal Stability of Flourinated Amorphous Carbon Films”, Thin Solid Films, 2006, JUL, vol. 510 (1-2), pp. 125-133.
    6. Liang-Guang Chen, Su-Jien Lin, and Shou-Yi Chang*, “Tensile Properties and Thermal Expansion Behaviors of Continuous Molybdenum Fiber Reinforced Aluminum Matrix Composites”, Composites Science and Technology, 2006, SEP, vol. 66 (11-12), pp. 1793-1802.
    7. Shou-Yi Chang* and Yi-Chung Huang, “Nanomechanical Analyses of Porous SiO2 Low-Dielectric-Constant Films for Evaluation of Interconnect Structure Reliability”, Microelectronic Engineering, 2006, OCT, vol. 83 (10), pp. 1940-1949.
    8. Shou-Yi Chang*, Yu-Shuien Lee, Hsiang-Long Hsiao, and Ting-Kui Chang, “Mechanical Properties and Deformation Behavior of Amorphous Nickel-Phosphorous Films Measured by Nanoindentation Test”, Metallurgical and Materials Transactions A, 2006, OCT, vol. 37A (10), pp. 2939-2945.
    9. Chia-Han Lai, Su-Jien Lin*, Jien-Wei Yeh, and Shou-Yi Chang, “Preparation and Characterization of AlCrTaTiZr Multi-element Nitride Coatings”, Surface & Coatings Technology, 2006, DEC, vol. 201 (6), pp. 3275-3280.
    10. 張守一 (Shou-Yi Chang)*, 張庭魁 (Ting-Kui Chang), and 蕭翔隆 (Hsiang-Long Hsiao), “晶粒尺寸效應對銅奈米機械性質與變形機制影響之研究 (Grain Size Effect on Nanomechanical Properties and Deformation Behavior of Copper)”, 材料科學與工程 (Journal of Materials Science and Engineering, Taiwan), 2006, SEP, vol. 38 (3), pp. 162-168.

    2005

    1. Chung-Jin Tong, Yu-Liang Chen, Swe-Kai Chen, Jien-Wei Yeh*, Tao-Tsung Shun, Chun-Huei Tsau, Su-Jien Lin, and Shou-Yi Chang, “Microstructure Characterization of AlxCoCrCuFeNi High-Entropy Alloy System with Multiprincipal Elements”, Metallurgical and Materials Transactions A, 2005, APR, vol. 36A (4), pp. 881-893.
    2. Chung-Jin Tong, Min-Ray Chen, Swe-Kai Chen, Jien-Wei Yeh*, Tao-Tsung Shun, Su-Jien Lin, and Shou-Yi Chang, “Mechanical Performance of AlxCoCrCuFeNi High-Entropy Alloy System with Multiprincipal Elements”, Metallurgical and Materials Transactions A, 2005, MAY, vol. 36A (5), pp. 1263-1271.
    3. Liang-Guang Chen, Su-Jien Lin, and Shou-Yi Chang*, “Analysis of Interfacial Shear Strength of SiC Fiber Reinforced 7075 Aluminum Composite by Pushout Microindentation”, Metallurgical and Materials Transactions A, 2005, JUL, vol. 36A (7), pp. 1937-1945.
    4. Chia-Han Lai, Ying-Chao Sung, Su-Jien Lin, Shou-Yi Chang*, and Jien-Wei Yeh, “Atomic-Scale Observation on the Nucleation and Growth of Displacement-Activated Palladium Catalysts and Electroless Copper Plating”, Electrochemical and Solid State Letters, 2005, AUG, vol. 8 (8), pp. C114-C116.
    5. Shou-Yi Chang*, Ting-Kui Chang, and Yu-Shuien Lee, “Nanoindentating Mechanical Responses and Interfacial Adhesion Strength of Electrochemically Deposited Copper Film”, Journal of The Electrochemical Society, 2005, OCT, vol. 152 (10), pp. C657-C663.
    6. Chia-Feng Lin*, Jing-Jie Dai, Zhong-Jie Yang, Jing-Hui Zheng, and Shou-Yi Chang, “Self-Assembled GaN:Mg Inverted Hexagonal Pyramids Formed Through a Photoelectrochemical Wet-Etching Process”, Electrochemical and Solid State Letters, 2005, DEC, vol. 8 (12), pp. C185-C188.

    2004

    1. Shou-Yi Chang*, Chi-Wei Lin, Hong-Hui Hsu, Jui-Hua Fang, and Su-Jien Lin, “Integrated Electrochemical Deposition of Copper Metallization for Ultralarge-Scale Integrated Circuits”, Journal of The Electrochemical Society, 2004, JAN, vol. 151 (1), pp. C81-C88.
    2. Jien-Wei Yeh*, Swe-Kai Chen, Su-Jien Lin, Jon-Yiew Gan, Tsung-Shune Chin, Tao-Tsung Shun, Chun-Huei Tsau, and Shou-Yi Chang, “Nanostructured High-Entropy Alloys with Multiple Principal Elements: Novel Alloy Design Concepts and Outcomes”, Advanced Engineering Materials, 2004, MAY, vol. 6 (5), pp. 299-303.
    3. Shou-Yi Chang*, Tsu-Jen Chou, Yung-Cheng Lu, Syun-Ming Jang, Su-Jien Lin, and Mong-Song Liang, “Curing Process Window and Thermal Stability of Porous MSQ-Based Low-Dielectric-Constant Materials”, Journal of The Electrochemical Society, 2004, JUN, vol. 151 (6), pp. F146-F152.
    4. Chia-Jung Hsu, Shou-Yi Chang*, Liang-Yu Chou, and Su-Jien Lin, “Resistance of Fibrous Reinforced Silver Matrix Composites to Repeated Make-Break Arc Erosion”, Journal of Materials Science, 2004, JUL, vol. 39 (13), pp. 4179-4184.
    5. Shou-Yi Chang, Hui-Lin Chang, Yung-Cheng Lu, Syun-Ming Jang, Su-Jien Lin*, and Mong-Song Liang, “Mechanical Property Analyses of Porous Low-Dielectric-Constant Films for Stability Evaluation of Multilevel-Interconnect Structures”, Thin Solid Films, 2004, JUL, vol. 460 (1-2), pp. 167-174.
    6. Jien-Wei Yeh*, Swe-Kai Chen, Jon-Yiew Gan, Su-Jien Lin, Tsung-Shune Chin, Tao-Tsung Shun, Chun-Huei Tsau, and Shou-Yi Chang, “Formation of Simple Crystal Structures in Cu-Co-Ni-Cr-Al-Fe-Ti-V Alloys with Multi-principal Metallic Elements”, Metallurgical and Materials Transactions A, Communications, 2004, AUG, vol. 35A (8), pp. 2533-2536.
    7. Shou-Yi Chang, Syun-Ming Jang, Su-Jien Lin*, and Mong-Song Liang, “Properties and Thermal Stability of Porous Organic Low-Dielectric-Constant Materials”, Thin Solid Films, 2004, NOV, vol. 466 (1-2), pp. 54-61.
    8. Hung-Jen Chen, Shou-Yi Chang, Hua-Chun Chiue, Wei-Shun Lai, and Su-Jien Lin*, “Processing and Characterization of Fluorinated Amorphous Carbon Low-Dielectric-Constant Films”, Journal of The Electrochemical Society, 2004, NOV, vol. 151 (11), pp. F276-F282.

    2003

    1. Shou-Yi Chang, Chia-Jung Hsu, Cher-Hao Hsu, and Su-Jien Lin*, “Investigation on the Arc Erosion Behavior of New Silver Matrix Composites: Part I. Reinforced by Particles”, Journal of Materials Research, 2003, APR, vol. 18 (4), pp. 804-816.
    2. Chia-Jung Hsu, Shou-Yi Chang, Liang-Yu Chou, and Su-Jien Lin*, “Investigation on the Arc Erosion Behavior of New Silver Matrix Composites: Part II. Reinforced by Short Fibers”, Journal of Materials Research, 2003, APR, vol. 18 (4), pp. 817-826.
    3. Shou-Yi Chang, Liang-Yu Chou, Cher-Hao Hsu, and Su-Jien Lin*, “Geometry Effect on Spark Erosion Behavior of Silver Matrix Composites”, Key Engineering Materials, 2003, SEP, vol. 249, pp. 183-188.
    4. Shou-Yi Chang, Chia-Jung Hsu, Ray-Hua Fang, and Su-Jien Lin*, “Electrochemical Deposition of Nanoscaled Palladium Catalysts for 65 nm Copper Metallization”, Journal of The Electrochemical Society, 2003, SEP, vol. 150 (9), pp. C603-C607.
    5. Shou-Yi Chang, Chi-Fang Chen, Su-Jien Lin*, and Theo. Z. Kattamis, “Electrical Resistivity of Metal Matrix Composites”, Acta Materialia, 2003, DEC, vol. 51 (20), pp. 6291-6302.
    6. 林樹均 (Su-Jien Lin)*, 葉均蔚 (Jien-Wei Yeh), 許宏輝 (Hong-Hui Hsu), and 張守一 (Shou-Yi Chang), “積體電路用無電鍍銅導線 (Electrolessly Plated Copper Interconnect for Integrated Circuits)”, 材料會訊 (Materials Science Bulletin, Taiwan), 2003, DEC, vol. 10 (4), pp. 9-23. (Invited Paper)

    2002

      1. Liang-Guang Chen, Kung-Hsien Shue, Shou-Yi Chang, and Su-Jien Lin*, “Squeeze Casting of SiCp/Al-Alloy Composites with Various Contents of Reinforcements”, Journal of Materials Research, 2002, FEB, vol. 17 (2), pp. 376-385.

      2000

      1. Shou-Yi Chang, Su-Jien Lin*, and Merton C. Flemings, “Thermal Expansion Behavior of Silver Matrix Composites”, Metallurgical and Materials Transactions A, 2000, JAN, vol. 31A, pp. 291-298.

      1999

      1. Wen-Seng Chung, Shou-Yi Chang, and Su-Jien Lin*, “Low Volume Fraction SiCp/AA 380.0 Composites Fabricated by Vacuum Infiltration”, Journal of Materials Research, 1999, MAR, vol. 14 (3), pp. 803-810.
      2. Shou-Yi Chang, Jiunn-Horng Lin, Su-Jien Lin*, and Theo Z. Kattamis, “Processing Copper and Silver Matrix Composites by Electroless Plating and Hot Pressing”, Metallurgical and Materials Transactions A, 1999, APR, vol. 30A, pp. 1119-1136.

      1997

      1. Shou-Yi Chang and Su-Jien Lin*, “Fabrication and Fracture Behavior of Metallic Fiber Reinforced NiAl Matrix Composites”, Scripta Materialia, 1997, JUL, vol. 37(1), pp. 23-30.
      2. Shou-Yi Chang and Su-Jien Lin*, “Processing Stainless Steel Fiber Reinforced NiAl Matrix Composites by Reactive Hot Pressing”, Journal of Materials Science, 1997, OCT, vol. 32 (19), pp. 5127-5135.

      1996

      1. Wen-Seng Chung, Shou-Yi Chang, and Su-Jien Lin*, “Electroless Nickel Plating on SiC Powder with Hypophosphite as a Reducing Agent”, Plating and Surface Finishing, 1996, MAR, vol. 83, pp. 68-71.
      2. Shou-Yi Chang and Su-Jien Lin*, “Fabrication of SiCw Reinforced Copper Matrix Composite by Electroless Copper Plating”, Scripta Materialia, 1996, JUL, vol. 35 (2), pp. 225-231.